EDA Architect Skill
Define the architecture and constraints for electronics projects.
Auto-Activation Triggers
This skill activates when:
- User asks to "design a board", "create a project", "start a new PCB"
- User asks "what do I need for..." an electronics project
- Project has no
docs/project-spec.md or docs/design-constraints.json
- User mentions requirements gathering or project planning
Context Requirements
Requires: Nothing (this is the first step)
Produces:
docs/project-spec.md - Human-readable specification
docs/design-constraints.json - Machine-readable constraints
Workflow
1. Understand the Project Goal
Ask the user about:
- What is this device/board intended to do?
- Target use case (prototype, production, hobby)?
- Any existing designs to reference?
2. Define Power Architecture
Determine:
- Input power source (USB, battery, mains, PoE, solar)
- Voltage rails needed (3.3V, 5V, 12V, etc.)
- Power topology per rail: LDO vs buck converter
- See
reference/POWER-TOPOLOGY-DECISION.md for decision tree
- Estimated power budget
- Battery life requirements if applicable
2.5 Thermal Budget
Estimate early:
- Total power dissipation (sum of all consumers)
- Hot components (any >0.5W needs attention)
- Cooling strategy: natural, forced, heatsink
- See
reference/THERMAL-BUDGET.md for estimation guide
3. Processing Requirements
Establish:
- MCU/processor needs (or if needed at all)
- Processing requirements (speed, peripherals)
- Memory requirements (Flash, RAM)
- Preferred families (STM32, ESP32, RP2040, etc.)
4. Connectivity & Interfaces
Document:
- Wireless: WiFi, Bluetooth, LoRa, Zigbee, cellular
- Wired: Ethernet, USB, CAN, RS485, RS232
- User interfaces: buttons, LEDs, displays
- Debug/programming interfaces
4.5 Stackup Decision
Determine layer count based on complexity:
- 2-layer: Simple, LDO only, low-speed (I2C/SPI)
- 4-layer: MCU with switching regulator, USB, Ethernet, WiFi
- 6-layer: High-speed (>100MHz), DDR, dense routing
- See
reference/LAYER-COUNT-DECISION.md for decision tree
5. Sensors & I/O
List:
- Required sensors
- Analog inputs/outputs
- Digital I/O requirements
- Any specialized interfaces (motor control, etc.)
6. Physical Constraints
Define:
- Target board dimensions
- Enclosure requirements
- Mounting hole positions
- Connector placement constraints
- Height restrictions
7. Environmental
Note:
- Operating temperature range
- Indoor/outdoor use
- IP rating if applicable
8. Manufacturing Targets
Capture:
- Target quantity
- Assembly method (hand, reflow, turnkey)
- Layer count preference
- Budget constraints
8.5 DFM Early Constraints
Capture manufacturer capabilities:
- Preferred manufacturer (JLCPCB, PCBWay, OSHPark)
- Assembly method constraints
- Fine-pitch components (affects hand soldering)
- Budget tier: prototype, low-volume, production
Output Format
project-spec.md Structure
# Project Specification: [Name]
## Overview
[Brief description and goals]
## Requirements Summary
| Category | Requirement |
|----------|-------------|
| Power Input | ... |
| Voltage Rails | ... |
| MCU | ... |
| Connectivity | ... |
## Detailed Requirements
[Sections for each category with full details]
## Constraints
[Physical, environmental, budget constraints]
## Open Questions
[Any unresolved items]
design-constraints.json Schema
See reference/CONSTRAINT-SCHEMA.md for full schema documentation.
Guidelines
- Ask clarifying questions rather than assuming
- Suggest common solutions when user is unsure
- Flag potential issues early (power budget, space constraints)
- Keep the spec focused - avoid scope creep
- Document rationale for key decisions
- Use project templates from
reference/PROJECT-TEMPLATES.md as starting points
Architecture Validation Warnings
Before completing the architecture phase, check for these risky combinations:
| Condition |
Warning |
| 2-layer + switching regulator |
"Consider 4-layer - switching regulators need solid ground plane" |
| 2-layer + USB/Ethernet |
"Controlled impedance difficult on 2-layer - consider 4-layer" |
| >2W total + no thermal plan |
"Add thermal budget - high power needs planning" |
| Hand assembly + fine-pitch (<0.5mm) |
"Verify solderability - fine-pitch is difficult to hand solder" |
| >0.5W component + no thermal strategy |
"Component dissipating >0.5W needs thermal attention" |
| Battery + LDO with high Vin-Vout |
"Consider buck converter for battery life" |
When a warning condition is detected, present it to the user and ask if they want to:
- Update the design to address it
- Acknowledge the risk and proceed
Next Steps
After completing architecture, suggest:
/eda-source [component-role] to begin component selection
- Start with critical components: MCU, power regulators
1---2name: eda-architect3description: Electronics project architecture and constraint definition. Guides users through defining project requirements, power systems, interfaces, and physical constraints.4---5
6# EDA Architect Skill
7
8Define the architecture and constraints for electronics projects.
9
10## Auto-Activation Triggers
11
12This skill activates when:
13- User asks to "design a board", "create a project", "start a new PCB"
14- User asks "what do I need for..." an electronics project
15- Project has no `docs/project-spec.md` or `docs/design-constraints.json`
16- User mentions requirements gathering or project planning
17
18## Context Requirements
19
20**Requires:** Nothing (this is the first step)
21
22**Produces:**
23- `docs/project-spec.md` - Human-readable specification
24- `docs/design-constraints.json` - Machine-readable constraints
25
26## Workflow
27
28### 1. Understand the Project Goal
29Ask the user about:
30- What is this device/board intended to do?
31- Target use case (prototype, production, hobby)?
32- Any existing designs to reference?
33
34### 2. Define Power Architecture
35Determine:
36- Input power source (USB, battery, mains, PoE, solar)
37- Voltage rails needed (3.3V, 5V, 12V, etc.)
38- Power topology per rail: LDO vs buck converter
39 - See `reference/POWER-TOPOLOGY-DECISION.md` for decision tree
40- Estimated power budget
41- Battery life requirements if applicable
42
43### 2.5 Thermal Budget
44Estimate early:
45- Total power dissipation (sum of all consumers)
46- Hot components (any >0.5W needs attention)
47- Cooling strategy: natural, forced, heatsink
48- See `reference/THERMAL-BUDGET.md` for estimation guide
49
50### 3. Processing Requirements
51Establish:
52- MCU/processor needs (or if needed at all)
53- Processing requirements (speed, peripherals)
54- Memory requirements (Flash, RAM)
55- Preferred families (STM32, ESP32, RP2040, etc.)
56
57### 4. Connectivity & Interfaces
58Document:
59- Wireless: WiFi, Bluetooth, LoRa, Zigbee, cellular
60- Wired: Ethernet, USB, CAN, RS485, RS232
61- User interfaces: buttons, LEDs, displays
62- Debug/programming interfaces
63
64### 4.5 Stackup Decision
65Determine layer count based on complexity:
66- 2-layer: Simple, LDO only, low-speed (I2C/SPI)
67- 4-layer: MCU with switching regulator, USB, Ethernet, WiFi
68- 6-layer: High-speed (>100MHz), DDR, dense routing
69- See `reference/LAYER-COUNT-DECISION.md` for decision tree
70
71### 5. Sensors & I/O
72List:
73- Required sensors
74- Analog inputs/outputs
75- Digital I/O requirements
76- Any specialized interfaces (motor control, etc.)
77
78### 6. Physical Constraints
79Define:
80- Target board dimensions
81- Enclosure requirements
82- Mounting hole positions
83- Connector placement constraints
84- Height restrictions
85
86### 7. Environmental
87Note:
88- Operating temperature range
89- Indoor/outdoor use
90- IP rating if applicable
91
92### 8. Manufacturing Targets
93Capture:
94- Target quantity
95- Assembly method (hand, reflow, turnkey)
96- Layer count preference
97- Budget constraints
98
99### 8.5 DFM Early Constraints
100Capture manufacturer capabilities:
101- Preferred manufacturer (JLCPCB, PCBWay, OSHPark)
102- Assembly method constraints
103- Fine-pitch components (affects hand soldering)
104- Budget tier: prototype, low-volume, production
105
106## Output Format
107
108### project-spec.md Structure
109
110```markdown
111# Project Specification: [Name]
112
113## Overview
114[Brief description and goals]
115
116## Requirements Summary
117| Category | Requirement |
118|----------|-------------|
119| Power Input | ... |
120| Voltage Rails | ... |
121| MCU | ... |
122| Connectivity | ... |
123
124## Detailed Requirements
125[Sections for each category with full details]
126
127## Constraints
128[Physical, environmental, budget constraints]
129
130## Open Questions
131[Any unresolved items]
132```
133
134### design-constraints.json Schema
135
136See `reference/CONSTRAINT-SCHEMA.md` for full schema documentation.
137
138## Guidelines
139
140- Ask clarifying questions rather than assuming
141- Suggest common solutions when user is unsure
142- Flag potential issues early (power budget, space constraints)
143- Keep the spec focused - avoid scope creep
144- Document rationale for key decisions
145- Use project templates from `reference/PROJECT-TEMPLATES.md` as starting points
146
147## Architecture Validation Warnings
148
149Before completing the architecture phase, check for these risky combinations:
150
151| Condition | Warning |
152|-----------|---------|
153| 2-layer + switching regulator | "Consider 4-layer - switching regulators need solid ground plane" |
154| 2-layer + USB/Ethernet | "Controlled impedance difficult on 2-layer - consider 4-layer" |
155| >2W total + no thermal plan | "Add thermal budget - high power needs planning" |
156| Hand assembly + fine-pitch (<0.5mm) | "Verify solderability - fine-pitch is difficult to hand solder" |
157| >0.5W component + no thermal strategy | "Component dissipating >0.5W needs thermal attention" |
158| Battery + LDO with high Vin-Vout | "Consider buck converter for battery life" |
159
160When a warning condition is detected, present it to the user and ask if they want to:
1611. Update the design to address it
1622. Acknowledge the risk and proceed
163
164## Next Steps
165
166After completing architecture, suggest:
1671. `/eda-source [component-role]` to begin component selection
1682. Start with critical components: MCU, power regulators