Spansion

Spansion Manufacturer Skill

Company Overview

Spansion was a leading manufacturer of Flash memory and microcontrollers, formed as a joint venture between AMD and Fujitsu in 2003. The company specialized in:

• NOR Flash Memory - Parallel and serial NOR Flash for code storage
• NAND Flash Memory - SLC and MLC NAND for data storage
• Microcontrollers - FM3 and FM4 ARM Cortex-based MCUs

Acquisition History:

• 2015: Acquired by Cypress Semiconductor
• 2020: Cypress acquired by Infineon Technologies
• Legacy Spansion parts are now manufactured under Infineon's brand

MPN Structure

Spansion MPNs follow product-family-specific structures:

NOR Flash Memory (S25, S29)

[PREFIX][FAMILY][DENSITY][SPEED][CONFIG][PACKAGE]
   │       │        │       │      │       │
   │       │        │       │      │       └── Package code (F, T, V, S, W, N, L, P)
   │       │        │       │      └── Configuration/feature code
   │       │        │       └── Speed grade
   │       │        └── Memory density (128=128Mbit, 256=256Mbit)
   │       └── Memory family (FL=Serial, GL=Parallel)
   └── S = Spansion prefix

NAND Flash Memory (S34ML, S35ML)

[PREFIX][FAMILY][DENSITY][CONFIG][PACKAGE]
   │       │        │       │       │
   │       │        │       │       └── Package code
   │       │        │       └── Configuration
   │       │        └── Density in Gbits
   │       └── ML = Multi-Level/Single-Level NAND
   └── S34/S35 = NAND prefix

Microcontrollers (MB9)

[PREFIX][FAMILY][VARIANT][SIZE][PACKAGE]
   │       │       │       │      │
   │       │       │       │      └── Package code
   │       │       │       └── Flash/RAM size indicator
   │       │       └── Feature variant (A, B, etc.)
   │       └── Family letter
   └── MB9 = FM MCU prefix

Product Families

NOR Flash Memory

NAND Flash Memory

Microcontrollers

Interface ICs

Package Codes

Example MPNs with Decoding

Serial NOR Flash

S25FL128SAGMFI00
│  │  │   │ │ │ │
│  │  │   │ │ │ └── 00 = Ordering code
│  │  │   │ │ └── I = Industrial temperature (-40 to +85C)
│  │  │   │ └── F = FBGA package
│  │  │   └── SAGM = Product variant (Speed/Config)
│  │  └── 128 = 128 Mbit density
│  └── FL = Serial Flash family
└── S25 = Spansion serial NOR prefix

Parallel NOR Flash

S29GL128P90TFI01
│  │  │   │ │ │ │
│  │  │   │ │ │ └── 01 = Ordering variant
│  │  │   │ │ └── I = Industrial temperature
│  │  │   │ └── TF = TSOP/FBGA package variant
│  │  │   └── 90 = 90ns access time
│  │  └── 128P = 128 Mbit, P variant
│  └── GL = Parallel (GLUE Logic) Flash family
└── S29 = Spansion parallel NOR prefix

SLC NAND Flash

S34ML01G200TFI00
│  │  │    │ │ │
│  │  │    │ │ └── 00 = Ordering code
│  │  │    │ └── TFI = Package + temperature
│  │  │    └── 200 = Page size variant
│  │  └── 01G = 1 Gbit density
│  └── ML = SLC NAND
└── S34 = Spansion NAND prefix

FM3 Microcontroller

MB9AF314NPMC
│  │ │  │ │ │
│  │ │  │ │ └── C = Variant
│  │ │  │ └── PM = Package code
│  │ │  └── N = Configuration
│  │ └── 314 = Series number
│  └── AF = FM3 ARM Cortex-M3 family
└── MB9 = Spansion MCU prefix

Series Extraction Rules

The handler extracts series based on prefix patterns:

Replacement Compatibility

The handler implements isOfficialReplacement() to determine if two parts are compatible replacements:

Flash Memory Replacement Logic

Two Flash parts are considered replacements if:

1. Same series (e.g., both S25FL)
2. Same density (e.g., both 128Mbit)
3. Same or compatible speed grade

// Example: S25FL128SAGMFI00 ≈ S25FL128LAGMFI01
// Both are 128Mbit S25FL, different variant letters

MCU Replacement Logic

Two MCUs are considered replacements if:

1. Same series (e.g., both MB9AF)
2. Same variant code (letter after series number)

Handler Implementation Notes

Supported ComponentTypes

getSupportedTypes() returns:
  - ComponentType.MEMORY         // Base memory type
  - ComponentType.MEMORY_FLASH   // Flash-specific type
  - ComponentType.MICROCONTROLLER // FM3/FM4 MCUs

Note: The handler also registers patterns for ComponentType.IC (USB controllers) but does not include it in getSupportedTypes(). This is a known inconsistency.

Pattern Registry

// NOR Flash
registry.addPattern(ComponentType.MEMORY, "^S29[A-Z][A-Z].*");   // Parallel NOR
registry.addPattern(ComponentType.MEMORY, "^S25FL.*");           // Serial NOR
registry.addPattern(ComponentType.MEMORY, "^S25FS.*");           // High-perf Serial

// NAND Flash
registry.addPattern(ComponentType.MEMORY, "^S34ML.*");           // SLC NAND
registry.addPattern(ComponentType.MEMORY, "^S35ML.*");           // MLC NAND

// Microcontrollers
registry.addPattern(ComponentType.MICROCONTROLLER, "^MB9[A-Z].*"); // FM3
registry.addPattern(ComponentType.MICROCONTROLLER, "^MB9B.*");     // FM4

// Interface ICs
registry.addPattern(ComponentType.IC, "^GL850.*");                // USB Hub
registry.addPattern(ComponentType.IC, "^FL1K.*");                 // USB Flash

Package Code Extraction

// Extracts suffix after alphanumeric base
String suffix = mpn.replaceAll("^[A-Z0-9]+", "");

// Maps single letter to package name
switch (suffix) {
    case "F" -> "FBGA";
    case "T" -> "TSOP";
    case "V" -> "VFBGA";
    case "S" -> "SO";
    case "W" -> "WSON";
    case "N" -> "PBGA";
    case "L" -> "PLCC";
    case "P" -> "PDIP";
    default -> suffix;  // Return as-is if unknown
}

Known Issue: The regex ^[A-Z0-9]+ removes all leading alphanumerics, which may not correctly isolate the package suffix in complex MPNs like "S25FL128SAGMFI00" where "00" is returned, not the package code embedded in the middle.

Memory Density Reference

Common NOR Flash Densities

Common NAND Flash Densities

Cross-Reference with Current Parts

Since Spansion is now part of Infineon, many parts have Infineon equivalents:

Related Files

• Handler: manufacturers/SpansionHandler.java
• Component types: MEMORY, MEMORY_FLASH, MICROCONTROLLER
• Pattern conflicts: May conflict with generic memory patterns

Learnings & Quirks

• Acquisition chain: Spansion -> Cypress -> Infineon. Legacy Spansion MPNs still use original numbering.
• MB9 MCUs: These are from the FM3/FM4 family, based on ARM Cortex-M3/M4 cores. They are largely obsolete now.
• Interface ICs (GL850, FL1K): These patterns are registered under ComponentType.IC but IC is not in getSupportedTypes() - this is a handler bug.
• Package extraction bug: The extractPackageCode() method uses a regex that strips too much, returning incorrect suffixes for complex MPNs.
• HashSet in getSupportedTypes(): The handler uses mutable HashSet instead of immutable Set.of() - should be fixed for consistency with other handlers.
• Serial vs Parallel Flash: S25xx = Serial (SPI interface), S29xx = Parallel (address/data bus interface).
• SLC vs MLC NAND: S34ML = SLC (Single-Level Cell, higher endurance, ~100K cycles), S35ML = MLC (Multi-Level Cell, higher density, ~10K cycles).
• Speed grade extraction: The handler extracts speed grade for Flash memory but the method may return incorrect values for some MPN formats.